ACF/ACP microspheres are specifically designed for cutting-edge applications in anisotropic conductive films and pastes (ACF/ACP). With a flexible polymer core, these spheres provide excellent adhesive properties, a critical attribute in the manufacturing of electronic components. The nickel and gold coatings on the exterior not only impart outstanding electrical conductivity to the microspheres but also ensure the maintenance of stable electrical properties across various industrial settings. As such, ACF/ACP microspheres play a pivotal role in the fabrication of high-end electronic devices, particularly in the manufacturing of LCD displays, semiconductor packaging, and the interconnection of flexible circuits.
Could be applied in COG(Chip-on-Glass) and FOG(Flex-on-Glass)
